Underfill Market to Grow at Fastest Pace Over the Forecast Period due to high Demand from Smart Phone and Tablet Industry

Global Underfill Market is segmented based on product type, application, and region. Micro CSP, Wafer Level Packaging (WLF), and QFN must encounter rising requirements such as reduced size, high reliability requirements, greater chip functionality, tough mechanical, also greater stress relaxation for thermal stress and extremely short solder joints. These are the requirement where Underfill comes in to adequately agreement with those developing challenges at PCB assembly.

Underfill is nothing but the bottom side of the silicon chip. Rising conservative CSP and BGA packaging onto the board using conventional gathering steps and techniques mainly produce mechanical and thermal properties.

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Underfill Market is classified, by application into Chip Scale Packaging (CSP), Ball Grid Array (BGA), Flip Chips, Automotive Electronics, Medical Electronics, Industrial electronics, and others. The Flip Chips segment is expected to grow gradually and show durable demand for Underfill products as compared to other applications.

The prominent factors that are playing major role in the growth of Underfill Market are increasing demand for high performing, cost effective, and small in size devices, increasing demand in smart phones and tablets, advanced technology in electronic industry.

Underfill Market is classified, by product type into MUF Underfill Material, CUF Underfill Material, NUF Underfill Material. The CUF Underfill material segment accounted for the largest market share of the Underfill Market and is expected to remain dominant over the forecast period. This is mainly due to the CUF is expected to be replaced by MUF materials over forecast period, and due to its high cost. Whereas, MUF Underfill Material segment is expected to grow at fastest pace over the forecast period.

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Underfill Market is segmented, geographically into North America, Europe (Eastern Europe, Western Europe), Asia Pacific, Latin America, Middle East and Africa. Globally, Asia Pacific regional market accounted for the largest market share of the Underfill Market and is estimated to remain dominant over the forecast period. Taiwan, China, Japan, and Korea are the major countries in Asia Pacific producing semiconductor packaging materials; followed by Europe and North America. Underfill Market key players are, Namics Corporation, Henkel, AIM Solder, Won Chemicals Co. Ltd, and Epoxy Technology Inc.